- Onsemi
- Taiwan,
- Full-Time
- <72 Hours
Package Development Engineer.
Before you go
Before you leave us, sign up for our email alerts
We don't do job spam, just the best digital jobs delivered straight to your inbox.
Package Development Engineer: our view in 3 lines...
- The Role:This role develops and qualifies advanced power module and power stage packages that deliver high-performance, cost-effective power semiconductor solutions.
- The Person:The person will lead package development from concept through production release, define package architecture and assembly process flow, develop substrate designs, drive flip chip integration, and lead package qualification and reliability testing.
- Requirements:The ideal candidate has 10+ years of semiconductor package development experience, expertise in flip chip assembly, advanced substrate design, thermal management and reliability engineering, and proficiency in ACAD, 8D, SPC, DFMEA and DOE.
About the role
Lead the development and qualification of advanced multi-Phase Power Module, DrMOS, and Smart Power Stage (SPS) packages. Responsible for package architecture, substrate design, flip-chip integration, passive component assembly, reliability qualification, and manufacturing readiness. Collaborate closely with Product Engineering, Silicon Design, Reliability, Operations, OSATs, and suppliers to deliver high-performance, cost-effective power packaging solutions.
Responsibilities
- Lead package development from concept through production release.
- Define package architecture, materials selection, and assembly process flow.
- Develop and optimize substrate designs including stack-up, routing, power planes, via structures, and thermal features.
- Drive flip-chip integration, bump design, underfill selection, and assembly process optimization.
- Develop passive component integration strategies for capacitors, resistors, and magnetic components.
- Perform electrical, thermal, and mechanical performance optimization.
- Lead package qualification and reliability testing per JEDEC and IPC standards.
- Conduct root cause analysis and implement corrective actions for package failures.
- Collaborate with OSATs and suppliers on DFM, process development, yield improvement, and cost reduction.
- Support NPI execution and transfer technologies into high-volume manufacturing.
Qualifications
- BS/MS in Electrical Engineering, Materials Science, Mechanical Engineering, or related field.
- 10+ years of semiconductor package development experience.
- Strong expertise in:Â
- Multi-Phase Power Modules, DrMOS, and SPS packaging
- Advanced substrate design and manufacturing
- Flip-chip assembly and package integration
- Passive component assembly and optimization
- Thermal management and reliability engineering
- High-volume manufacturing and NPI processes
- Experience working with OSATs, substrate suppliers, and material vendors.
- Strong communication skills, with the ability to effectively collaborate with Business Units, cross-functional teams, internal and external manufacturing partners, and customers.
- Proficiency in engineering tools and methodologies, including ACAD, 8D, SPC, DFMEA, DOE.
- Proven ability to lead projects across organizations and cultures in a fast-paced environment.
About Us
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here: