- Onsemi
- Waterloo, IA
- Full-Time
- 37 days ago
Semiconductor Packaging Modeling and Simulation Engineer.
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Semiconductor Packaging Modeling and Simulation Engineer: our view in 3 lines...
- The Role:This role is for an engineer who models and simulates semiconductor packaging and power module designs for R&D and product development.
- The Person:The person will run thermal-mechanical simulations, analyse reliability issues, correlate models to measured data, maintain modelling methodology and software environments, and support other users.
- Requirements:The role calls for a Master or PhD degree in Physics, Mechanical Engineering, Computational Mechanics, Solid Mechanics or Materials, plus experience with thermal, mech modeling, CAD concepts, Solidworks, Unix/Linux, and ANSYS Mechanical APDL/Work Bench.
About the role
Job Summary:
ON Semiconductor is seeking a self-driven and motivated professional to join their Corporate R & D modeling and simulation team, located in Waterloo, Ontario N2V 1KB, Canada. As a semiconductor packaging modeling and simulation engineer, you will have the opportunities to support new power module development and new product design, assembly and process, quality and reliability, and customers in worldwide.
Performance Objectives:
The successful candidate will have the opportunity to:
• Do thermal-mech simulation for microelectronic packaging and system, assembly process
such as Ag sintering and Cu sintering
• Analyze existing packages of reliability issues that are induced by thermal problems.
• Do analysis and correlation of thermal mech modeling results to measured data
• Develop and maintain the state of art thermal mech modeling methodology to improve the modeling work efficiency and accuracy
• Setup and maintain the HW/SW environment for thermal modeling
• Provide support to other thermal mech modeling users in the company
• Innovation of new technology through simulation
• Develop the state of art simulation methodology such as Digital Twin, AI and machine learning algorithm, crystal plasticity model, Ag and Cu sintering model, probability and optimization algorithm for component and system level models
Requirements:
• Master or PhD degree in Physics, Mechanical Engineering, Computational Mechanics, Solid Mechanics or Materials
• Knowledge and experience on thermal, mech modeling as well as crystal plasticity, and Cu/Ag sintering process
• Knowledge and experience of CAD concepts and Solidworks
• Familiar with semiconductor packaging
• Familiar with material thermal mech properties
• Strong knowledge of problem analysis and diagnosis technique
• Deep knowledge of non-linear solid mechanics, fracture mechanics and delamination
• Familiar with package test and analysis, quality assurance, and reliability methods
• Ability to perform model correlation to empirical measurement
• Familiar with the Unix/Linux operating system
• Familiar with FEA software ANSYS Mechanical APDL/Work Bench
• Strong English communication capability
• Strong learning capability
• Good team player
ON Semiconductor (Nasdaq: ON) is driving energy efficient innovations, empowering customers to reduce global energy use. The company is a leading supplier of semiconductor-based solutions, offering a comprehensive portfolio of energy efficient power and signal management, logic, standard and custom devices. The company’s products help engineers solve their unique design challenges in automotive, communications, computing, consumer, industrial, medical and military/aerospace applications. ON Semiconductor operates a responsive, reliable, world-class supply chain and quality program, and a network of manufacturing facilities, sales offices and design centers in key markets throughout North America, Europe and the Asia Pacific regions.
More details about our company benefits can be found here:
We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.

