Micron Technology Inc

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480 open roles · Clay

Work at Micron Technology Inc.

Micron Technology Inc. is a global semiconductor company that designs and manufactures memory and storage solutions, including DRAM, NAND, and NOR products. It serves enterprise, cloud, mobile, automotive, and consumer markets and is widely...

Technology
Open roles 480
Founded 1978
Type Public
Headquarters Clay
Website micron.com
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Open roles at Micron Technology Inc

480 open roles
Staff AI Engineering Boise · Boise Salary TBC 34 days ago Staff AI Engineering Boise · Boise Salary TBC 34 days ago Sr AI Engineer, Platform Boise · Boise Salary TBC 35 days ago Staff/Principal Engineer, HIG-HBM Product System Engineering (Media Health Manufacturing) Fab 10A · Fab 10A Salary TBC 35 days ago Advanced CMOS Device & Process Integration Engineer Hiroshima · Hiroshima Salary TBC 35 days ago PI3 Cell Engineer Taichung · Taichung Salary TBC 35 days ago Advanced CMOS Device & Process Integration Engineer Hiroshima · Hiroshima Salary TBC 35 days ago Principal ASIC Design Engineer Boise · Boise Salary TBC 35 days ago Process Engineer, APTD Boise · Boise Salary TBC 35 days ago Director / DMTS, Process Integration Lead – Advanced Packaging (2.5D/3D, HBM, Hybrid Bonding) Boise · Boise Salary TBC 35 days ago Firmware Engineer Longmont-MAX · Longmont-MAX Salary TBC 35 days ago Semiconductor Process Engineer Boise · Boise Salary TBC 35 days ago MTS Process Integration Engineer | APTD Die Level Technology Boise · Boise Salary TBC 35 days ago Advanced CMOS Device & Process Integration Engineer Hiroshima · Hiroshima Salary TBC 35 days ago Senior/Principal Engineer, FE OCT CPEE PHOTO METROLOGY Hiroshima · Hiroshima Salary TBC 35 days ago OMT Equipment (SHIFT) Engineer Tainan · Tainan Salary TBC 35 days ago Principal Engineer - HIG Component Validation Boise · Boise Salary TBC 35 days ago MTS, Systems Engineer San Jose · San Jose Salary TBC 35 days ago Intern - MSB Automation Engineer MSB · MSB Salary TBC 35 days ago SR. Process Engineer, PHOTO SCANNER (Tongluo, Miaoli) Miaoli · Miaoli Salary TBC 36 days ago Principal Engineer (Advance Data Analytics), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM) Product Engineering Fab 10A · Fab 10A Salary TBC 36 days ago ENGINEER, F16N HVM PROD. SIA(Taichung/Tainan/Tongluo/Taoyuan) Miaoli · Miaoli Salary TBC 36 days ago Package Design and Development Quality Assurance Engineer - Data Analytics Boise · Boise Salary TBC 36 days ago Staff Memory Design Engineer, HBM Richardson · Richardson Salary TBC 36 days ago Staff/Principal Engineer, Product Engineering, Media Health Reliability, HIG-HBM Fab 10A · Fab 10A Salary TBC 36 days ago

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